Thermal Performance of Loop Thermosyphon Charged by Nanofluid for Cooling Electronic Component.

Document Type : Research Studies

Authors

1 Mechanical Power Engineering, Faculty of Engineering, Mansoura University, Egypt

2 Mechanical power Engineering Dept., Faculty of Engineering, Mansoura University, Mansoura, Egypt

3 Mechanical power Engineering Dept., Faculty of Engineering, Fayoum University, Fayoum, Egypt

Abstract

This work presents a theoretical and experimental investigation on the thermal performance of thermosyphon for cooling high heat flux. The working fluid charged in the evaporator is pure water or Nano fluid (Al2O3+water). In theoretical model, the flow is described by continuity, momentum and energy equations. The flow is assumed laminar, steady and two dimensional with constant properties. The differential forms of governing equations are, numerically, solved using finite difference technique. According to this technique, the partial differentials are transformed to set of linear algebraic equations. These equations are solved, numerically, by Gauss-Siedel iterative method. an experimental set up is design and constructed to study its under different operating To investigation the effect of parameters; - working fluid filling ratio (volume of working fluid to the evaporator volume (30%, to 70%)),volume fraction of nanoparticle in the base fluid 0.0%, to 1.6%.  , heat input rate total thermal resistance of the thermosyphon with the Nano fluid and with pure water. Results show that the addition of 0.8% (by volume) of Al2O3 nano-particles in water presented improved thermal performance compared with the operation with pure water. Results showed that the total thermal resistance decreases with increasing particles from 0% to 0.8% concentration, as compared with those of pure water. , but they increased as the concentration changed from 0.8% to 1.6%. Thus found an optimal particle which was about 0.8% for the. Al2O3-water based nanofluid. The experimental data are compared with the available literature.

Keywords

Main Subjects